According to Yole's market research report, Shenghe Jingwei is the company with the highest revenue growth in the global packaging and testing industry in . According to the CIC China Insights Consulting's "Global Advanced Packaging Industry Research Report" on the statistics of the advanced packaging industry in mainland China in , Shenghe Jingwei has the largest inch midsegment bumping processing capacity, the largest inch WLCSP market share, and the largest independent CP wafer testing revenue. As of the date of publication of its report in , Shenghe Jingwei is the only company in mainland China that massproduces siliconbased chip processing.
In recent years, Shenghe Jingwei has continued to innovate, from precision to breadth, and has made progress in multiple advanced packaging technology and process platforms. In May , it launched TSV silicon via substrate switzerland phone number list technology with times the mask size, marking that its chip interconnection advanced packaging technology has entered the submicron era, and has the ability to further improve the chip interconnection density, thereby continuously seizing the technological commanding heights and maintaining development opportunities.
This financing of over RMB billion will support the construction of the company's ongoing ultrahighdensity threedimensional multichip interconnect integrated processing project. Through highperformance integrated packaging onestop services, the company will further enhance its comprehensive technical strength in the field of highend advanced packaging and enhance its ability to serve the construction of digital economic infrastructure.